DocumentCode
1839175
Title
Reduction of PFC emissions by gas circulation cleaning in plasma CVD
Author
Nakata, Rempei ; Kubota, Hiroshi ; Kaji, Naruhiko ; Sakai, Itsuko ; Yoda, Takashi ; Okumura, Katsuya
Author_Institution
Process. & Manuf. Eng. Centre, Toshiba Corp., Yokohama, Japan
fYear
2001
fDate
2001
Firstpage
229
Lastpage
232
Abstract
A new method for plasma-CVD chamber cleaning using gas circulation has been developed. Unused gas contained in the exhaust gas during chamber cleaning was returned to chamber, and it was reused. Using this method, approximately 50% reduction of the amount of C2F6 used and net PFC emissions could be achieved without increasing the cleaning endpoint time
Keywords
air pollution control; plasma CVD; recycling; semiconductor technology; surface cleaning; cleaning endpoint time; exhaust gas; gas circulation; perfluorocompound emissions reduction; plasma-CVD chamber cleaning; semiconductor industry; Cleaning; Electronics industry; Fluid flow; Gases; Plasma applications; Plasma chemistry; Plasma materials processing; Pressure control; Semiconductor films; Valves;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-6731-6
Type
conf
DOI
10.1109/ISSM.2001.962955
Filename
962955
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