Title :
Highly sensitive inspection system for lithography-related faults in agile-fab detecting algorithm, monitoring and evaluation of yield impact
Author :
Matsushita, H. ; Mitsutake, K. ; Arakawa, Y. ; Ishibumi, T. ; Ushiku, Y.
Author_Institution :
Process & Manuf. Eng. Center, Toshiba Corp., Yokohama, Japan
Abstract :
We performed automatic detection of lithography-related faults by characteristic factors calculated from Fail Bit Count (FBC) data. The frequency of lithography-related faults was monitored as time series data and their origin was specified by correlating machine data. We could classify lithography-related faults and evaluate their yield impact from their frequency and yield loss automatically
Keywords :
automatic optical inspection; failure analysis; image matching; integrated circuit yield; lithography; process monitoring; time series; IC manufacture; agile fabrication facility; agile-fab; automatic detection; characteristic factors; fail bit count data; highly sensitive inspection system; lithography-related faults; machine data correlation; monitoring; time series data; yield impact; yield loss; Autocorrelation; Computerized monitoring; Condition monitoring; Fault detection; Frequency; Image segmentation; Inspection; Manufacturing automation; Manufacturing processes; Semiconductor device manufacture;
Conference_Titel :
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6731-6
DOI :
10.1109/ISSM.2001.962957
