DocumentCode :
1839242
Title :
High transmission performance integrated antennas on SOI substrate for VLSI wireless interconnects
Author :
Triantafyllou, Anna ; Farcy, Alexis ; Benech, Philippe ; Ndagijimana, Fabien ; Torres, Joaquin ; Exshaw, Olivier ; Tinella, Carlo ; Richard, Olivier ; Raynaud, Christine
Author_Institution :
STMicroelectronics, Crolles, France
fYear :
2005
fDate :
6-8 June 2005
Firstpage :
80
Lastpage :
82
Abstract :
Alternative interconnect systems were recently proposed in order to overcome the problems of time delay, surface, and power consumption related to global traditional ones. The feasibility of wireless intra chip interconnects is studied, by focusing on system transmission properties and parasitic effects between integrated antennas and nearby interconnects. Technological processes were considered in order to deduce innovative design concepts that combine improved transmitted power and reduced interferences between antenna and nearby components on a SOI substrate using CMOS 120 nm technology. As a result, it is shown that moving away locally surrounding metallization greatly improves transmission and that crosstalk effects are of the same order with those of conventional interconnect systems. Wireless interconnect performances and compatibility with standard BEOL are demonstrated.
Keywords :
CMOS integrated circuits; VLSI; crosstalk; dipole antennas; integrated circuit interconnections; integrated circuit metallisation; microstrip lines; radio links; silicon-on-insulator; 10 to 40 GHz; 120 nm; BEOL; CMOS technology; SOI substrates; VLSI wireless interconnects; antenna/interconnect parasitic effects; crosstalk effects; dipole antennas; high transmission performance antennas; integrated antennas; interference reduction; metal exclusion zone; microstrip lines; transmitted power increase; wireless intra chip interconnects; Antenna accessories; CMOS process; CMOS technology; Delay effects; Energy consumption; Interference; Metallization; Power system interconnection; Transmitting antennas; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International
Print_ISBN :
0-7803-8752-X
Type :
conf
DOI :
10.1109/IITC.2005.1499931
Filename :
1499931
Link To Document :
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