Title :
Layout manufacturability analysis using rigorous 3-d topography simulation
Author :
Strojwas, Andrzej J. ; Zhu, Zhengrong ; Ciplickas, Dennis ; Li, Xiaolei
Author_Institution :
Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
This paper presents the latest development of Metropole-3D, a three-dimensional vector simulator that is designed to rigorously simulate the photolithography process in VLSI manufacturing. The development work includes implementation of an efficient and stable solution of Maxwell´s equation, a rigorous model for post-exposure bake (PEB) and a fast marching module which simulates the development of photoresist. The integration of these features into a rigorous overall simulation approach enables Metropole-3D to meet the demands of simulating DUV and even more advanced lithography process. Simulation of Focus-Exposure Matrix (FEM) conditions shows good matching to experiments in both dense and isolated lines. Process variation analysis using Metropole-3D is demonstrated in a study of undercut and other effects as function of defocus, dose, or other parameters. Finally, line end printability analysis is shown, as an example use of Metropole-3D to study manufacturability of advanced optical proximity correction (OPC)
Keywords :
Maxwell equations; VLSI; circuit simulation; etching; integrated circuit layout; integrated circuit manufacture; integrated circuit modelling; photolithography; Maxwell´s equation; Metropole-31; VLSI; advanced optical proximity correction; calibration; etch simulation; fast marching module; focus-exposure matrix; line analysis; manufacturability; photolithography; photoresist; post-exposure bake; printability analysis; process variation analysis; three-dimensional vector simulator; topography simulation; Analytical models; Etching; Focusing; Level set; Lithography; Manufacturing processes; Maxwell equations; Resists; Surfaces; Virtual manufacturing;
Conference_Titel :
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6731-6
DOI :
10.1109/ISSM.2001.962963