Title :
Manufacturing experience with high performance mixed dielectric circuit boards
Author :
Farquhar, Donald S. ; Seman, Andy ; Poliks, Mark D.
Author_Institution :
IBM Microelectron., Endicott, NY, USA
Abstract :
A wide range of advanced dielectric materials are available for use in high speed digital and RF/microwave printed circuit boards. These materials present new challenges in the manufacturing process, especially when they are combined in mixed or unbalanced structures. The properties of these materials are reviewed, and their impact on manufacturing in various product applications is discussed
Keywords :
UHF circuits; dielectric thin films; digital circuits; laminates; microwave circuits; polymer films; printed circuit manufacture; RF PCBs; high performance boards; manufacturing experience; microwave PCBs; mixed dielectric circuit boards; printed circuit boards; speed digital PCBs; Costs; Dielectric constant; Dielectric materials; Laminates; Low earth orbit satellites; Manufacturing; Packaging; Printed circuits; Temperature dependence; Wiring;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678799
