• DocumentCode
    1839499
  • Title

    Impedance Estimation of Soft Tissue Using Ultrasound Signal

  • Author

    Fukuda, O. ; Tsubai, M. ; Ueno, N.

  • Author_Institution
    Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Saga
  • fYear
    2007
  • fDate
    22-26 Aug. 2007
  • Firstpage
    3563
  • Lastpage
    3568
  • Abstract
    This paper proposes a new impedance estimation method for soft tissue using ultrasound. This method estimates the impedance distribution inside an object. An ultrasound probe, which is attached to a force sensor, compresses soft tissue and observes the deformation process of tissue while measuring reaction force. The impedance parameters are then estimated based on this information. Experiments were conducted under two conditions, a static analysis and a dynamic analysis. In the static analysis, the ultrasound probe compressed the soft tissue slowly while keeping a balance of the power. In the dynamic analysis, the probe compressed tissue dynamically, and the deformation process of the soft tissue was observed. Experimental results demonstrated that our method can estimate the impedance of a soft object.
  • Keywords
    biological tissues; biomechanics; biomedical ultrasonics; deformation; force sensors; deformation process; force sensor; impedance distribution; mechanical impedance estimation method; soft tissue compression; ultrasound probe; ultrasound signal; Biological tissues; Biomedical measurements; Capacitive sensors; Elasticity; Force measurement; Force sensors; Impedance; Probes; Strain measurement; Ultrasonic imaging; Algorithms; Computer Simulation; Connective Tissue; Elasticity; Elasticity Imaging Techniques; Electric Impedance; Image Enhancement; Image Interpretation, Computer-Assisted; Models, Biological; Reproducibility of Results; Sensitivity and Specificity; Stress, Mechanical;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
  • Conference_Location
    Lyon
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-0787-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2007.4353101
  • Filename
    4353101