Title :
Low profile cavity backed antennas based on substrate integrated waveguide technology
Author_Institution :
Microelectron. CAD Center, Hangzhou Dianzi Univ., Hangzhou, China
Abstract :
A series of low profile cavity backed antennas (CBAs) based on substrate integrated waveguide (SIW) technology developed in the Key Laboratory of RF Circuits & System of Ministry of Education, Hangzhou Dianzi University has been reviewed in this paper. These linearly and circularly polarized antennas and their performance improved methods such as bandwidth enhancement and size reduction have been presented. These novel antennas retain the advantage of conventional metallic cavity backed antenna, including high gain, high front-to-back ratio, and low cross polarization level, and also keep the advantage of microstrip antenna including low profile, light weight, low fabrication cost, and easy integration with planar circuit.
Keywords :
electromagnetic wave polarisation; microstrip antennas; substrate integrated waveguides; waveguide antennas; Hangzhou Dianzi University; Key Laboratory of RF Circuits & System; Ministry of Education; SIW technology; bandwidth enhancement; circularly polarized antennas; cross polarization level; fabrication cost; front-to-back ratio; linearly polarized antennas; low profile CBA; low profile cavity backed antennas; metallic cavity backed antenna; microstrip antenna; planar circuit; size reduction; substrate integrated waveguide technology; Antenna radiation patterns; Bandwidth; Cavity resonators; Impedance; Slot antennas; Substrates; Low profile; cavity backed antenna (CBA); substrate integrated waveguide (SIW);
Conference_Titel :
Antennas and Propagation (APCAP), 2012 IEEE Asia-Pacific Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0666-9
DOI :
10.1109/APCAP.2012.6333252