DocumentCode :
1839791
Title :
Hermal failure simulation for electrical overstress in semiconductor devices
Author :
Diaz, Carlos ; Duvvury, Charvaka ; Sung-Mo Kang
Author_Institution :
University of Illinois
fYear :
1993
fDate :
3-6 May 1993
Firstpage :
1389
Lastpage :
1392
Keywords :
Circuit simulation; Computational modeling; Earth Observing System; Electrostatic discharge; Instruments; Integrated circuit modeling; Process design; Protection; Semiconductor devices; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 1993., ISCAS '93, 1993 IEEE International Symposium on
Conference_Location :
IEEE
Print_ISBN :
0-7803-1281-3
Type :
conf
Filename :
692914
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1839791
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