Title :
Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystems
Author :
Mendes, P.M. ; Bartek, M. ; Burghartz, J.N. ; Correia, J.H.
Author_Institution :
Dept. of Ind. Electron., Univ. of Minho, Portugal
Abstract :
We report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chip-scale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows on-chip integration and is the main issue of our work. A short-range wireless link between two systems both equipped with a 11.7/spl times/l2.4 mm/sup 2/ patch antenna (measured characteristics: 6 GHz central frequency, 100 MHz bandwidth @ -10 dB, 3 dB gain, 51% efficiency) realized on a Coming Pyrex #7740 glass substrate is demonstrated.
Keywords :
active antennas; chip scale packaging; micromechanical devices; microstrip antennas; wafer bonding; 100 MHz; 3 dB; 6 GHz; MEMS technology; adhesive wafer bonding; chip-size antennas; glass substrate; on-chip integration; patch antenna; short-range wireless link; silicon-compatible substrate; through-wafer electrical via formation; transmission line model; wafer-level chip-scale packaging; wireless microsystems; Antenna measurements; Chip scale packaging; Frequency measurement; Gain measurement; Glass; Patch antennas; Radio frequency; Semiconductor device measurement; Wafer bonding; Wafer scale integration;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2003. IEEE
Conference_Location :
Columbus, OH, USA
Print_ISBN :
0-7803-7846-6
DOI :
10.1109/APS.2003.1219324
