DocumentCode
1839937
Title
Analysis of surface roughness scattering and its contribution to conductivity degradation in nanoscale interconnects
Author
Deng, Rui ; Dunham, Scott
Author_Institution
Dept. of Phys., Univ. of Washington, Seattle, WA, USA
fYear
2005
fDate
6-8 June 2005
Firstpage
147
Lastpage
149
Abstract
We use a quantum mechanical calculation of momentum loss rates as function of spatial frequency of surface roughness to identify which frequencies contribute most strongly to conductivity degradation. We combine these calculations with surface roughness spectrum from atomic step model matched to AFM data. We find that roughness with period on the order of 300 nm gives greatest contribution to resistance increase, but that scattering from typical Cu surfaces can be expected to be nearly specular. We attribute apparent surface scattering to adhesion/barrier layer properties rather than interface or surface roughness.
Keywords
copper; electric resistance; electrical conductivity; integrated circuit interconnections; nanotechnology; quantum theory; scattering; surface roughness; AFM data; Cu; Cu surfaces; adhesion/barrier layer properties; atomic step model; conductivity degradation; momentum loss rates; nanoscale interconnects; quantum mechanical calculation; resistance increase; spatial frequency; surface roughness scattering; Adhesives; Atomic layer deposition; Conductivity; Degradation; Frequency; Particle scattering; Quantum mechanics; Rough surfaces; Surface resistance; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International
Print_ISBN
0-7803-8752-X
Type
conf
DOI
10.1109/IITC.2005.1499958
Filename
1499958
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