• DocumentCode
    1839937
  • Title

    Analysis of surface roughness scattering and its contribution to conductivity degradation in nanoscale interconnects

  • Author

    Deng, Rui ; Dunham, Scott

  • Author_Institution
    Dept. of Phys., Univ. of Washington, Seattle, WA, USA
  • fYear
    2005
  • fDate
    6-8 June 2005
  • Firstpage
    147
  • Lastpage
    149
  • Abstract
    We use a quantum mechanical calculation of momentum loss rates as function of spatial frequency of surface roughness to identify which frequencies contribute most strongly to conductivity degradation. We combine these calculations with surface roughness spectrum from atomic step model matched to AFM data. We find that roughness with period on the order of 300 nm gives greatest contribution to resistance increase, but that scattering from typical Cu surfaces can be expected to be nearly specular. We attribute apparent surface scattering to adhesion/barrier layer properties rather than interface or surface roughness.
  • Keywords
    copper; electric resistance; electrical conductivity; integrated circuit interconnections; nanotechnology; quantum theory; scattering; surface roughness; AFM data; Cu; Cu surfaces; adhesion/barrier layer properties; atomic step model; conductivity degradation; momentum loss rates; nanoscale interconnects; quantum mechanical calculation; resistance increase; spatial frequency; surface roughness scattering; Adhesives; Atomic layer deposition; Conductivity; Degradation; Frequency; Particle scattering; Quantum mechanics; Rough surfaces; Surface resistance; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International
  • Print_ISBN
    0-7803-8752-X
  • Type

    conf

  • DOI
    10.1109/IITC.2005.1499958
  • Filename
    1499958