DocumentCode :
1839963
Title :
An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures
Author :
Haque, Shatil ; Xing, Kun ; Lin, Ray-Lee ; Suchicital, C. ; Lu, G.-Q. ; Nelson, D.J. ; Borojevic, D. ; Lee, F.C.
Author_Institution :
Power Electron. Center, Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
fYear :
1998
fDate :
25-28 May 1998
Firstpage :
922
Lastpage :
929
Abstract :
Power Electronics Building Blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At Virginia Power Electronics Center (VPEC), we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating
Keywords :
invertors; modules; packaging; power electronics; 15 kW; 20 kHz; 3.3 kW; 400 V; 600 V; Cu; MPIPPS packaging; air-cooled inverter; direct bulk copper attachment; fiber-optic receiver/transmitter interface; gate driver; integrated power module; metal posts interconnected parallel plate structure; power electronic building block; power integrated circuit; power semiconductor device; protection circuit; sensor; soft switching; totem pole; two-switch two-diode half-bridge converter; Circuit topology; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Inverters; Packaging machines; Power electronics; Protection; Prototypes; Semiconductor device packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
ISSN :
0569-5503
Print_ISBN :
0-7803-4526-6
Type :
conf
DOI :
10.1109/ECTC.1998.678819
Filename :
678819
Link To Document :
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