DocumentCode
1840000
Title
Cray T3D: a new dimension for Cray Research
Author
Kessler, R.E. ; Schwarzmeier, J.L.
Author_Institution
Cray Research, Inc., Chippewa Falls, WI, USA
fYear
1993
fDate
22-26 Feb. 1993
Firstpage
176
Lastpage
182
Abstract
The authors present Cray Research´s massively parallel processing (MPP) philosophy, together with a brief description of the design of the Cray T3D, the first MPP designed by Cray Research. They give a brief overview of the important features of the Cray T3D, including the 3-D torus interprocessor interconnect. They discuss in more detail the motivation for the 3-D torus interconnect. Using a very simple capacity model of network performance, they show how three dimensions provide a solid balance between locality and scalability up to thousands of nodes.<>
Keywords
parallel processing; 3-D torus interprocessor interconnect; Cray Research; Cray T3D; locality; massively parallel processing; network performance; scalability; Atmospheric modeling; Computational fluid dynamics; Data processing; Electromagnetic analysis; Microprocessors; Parallel processing; Programming profession; Scalability; Solid modeling; Supercomputers;
fLanguage
English
Publisher
ieee
Conference_Titel
Compcon Spring '93, Digest of Papers.
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-8186-3400-6
Type
conf
DOI
10.1109/CMPCON.1993.289660
Filename
289660
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