A laser formed MakeLink* for customization and repair

Author

Bernstein, Joseph B. ; Lee, Joohan

Author_Institution

Dept. of Mater. & Nucl. Eng., Maryland Univ., College Park, MD, USA

fYear

2001

fDate

2001

Firstpage

347

Lastpage

350

Abstract

Some applications are presented for implementing a novel laser-programmable interconnect element (MakeLink^TM) formed vertically between two standard metallization layers. The average electrical resistance for the smallest link is less than 10Ω at optimal laser energy. Life tests under accelerating DC current densities and temperatures indicated high electromigration reliability. This technology is shown to be scaleable down to 1.5 μm pitch based on commercially available laser systems. Finite element models of various structures were simulated and the results show that there exists an acceptable process window for any scaled link. Properties such as standard CMOS process compatibility, no programming circuit, high current handling capability, hermeticity and radiation hardness, make it useful in customizable devices and to replace laser fuses for yield enhancement and other rapid customization applications

Keywords

electromigration; finite element analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit yield; laser materials processing; life testing; maintenance engineering; 1.5 micron; 10 ohm; CMOS process compatibility; DC current density; MakeLink; accelerated life testing; customization; electrical resistance; electromigration reliability; finite element model; hermeticity; laser-programmable interconnect; metallization; process window; radiation hardness; repair; yield; CMOS technology; Current density; Electric resistance; Electromigration; Integrated circuit interconnections; Laser modes; Life estimation; Life testing; Metallization; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Symposium, 2001 IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6731-6

Type

conf

DOI

10.1109/ISSM.2001.962985

Filename

962985