High-density probe substrate for testing optical interconnects

Author

Thacker, Hiren D. ; Ogunsola, Oluwafemi O. ; Bakir, Muhannad S. ; Meindl, James D.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2005

fDate

6-8 June 2005

Firstpage

159

Lastpage

161

Abstract

The design, fabrication, and demonstration of a high-density probe substrate (100 μm pitch) for testing chips with electrical and optical input/output (I/O) interconnects are presented. The primary purpose of this substrate is to provide nondamaging, temporary interconnections between the device-under-test (DUT) and the automated test equipment (ATE) during wafer probing - an essential step in the system-on-chip (SOC) manufacturing process. Optical probing of an array of polymer pillar-based optical I/O interconnects is demonstrated for the first time, to the authors´ knowledge.

Keywords

automatic test equipment; integrated circuit interconnections; integrated circuit testing; integrated optoelectronics; optical interconnections; optical testing; probes; 100 micron; ATE; SOC manufacturing process; automated test equipment; electrical I/O interconnects; electrical probes; high-density probe substrate; nondamaging temporary interconnections; optical interconnect testing; optical probes; optical wafer probing; polymer pillar-based optical I/O interconnects; Manufacturing processes; Optical arrays; Optical design; Optical device fabrication; Optical interconnections; Optical polymers; Probes; System-on-a-chip; Test equipment; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International

Print_ISBN

0-7803-8752-X

Type

conf

DOI

10.1109/IITC.2005.1499962

Filename

1499962