DocumentCode
1840120
Title
Characteristics of UV confocal microscopy inspection for detecting 0.1 μm level defects
Author
Sang Mun Chon ; Sang Bong Choi ; Dong Chun Lee ; Sam Jun, Chung ; Sung Gon Ryu ; Sun Yong Choi
Author_Institution
Samsung Electron. Co., Gyunggi, South Korea
fYear
2001
fDate
2001
Firstpage
359
Lastpage
362
Abstract
Due to shrinkage of design rule, optical in-line defect inspection with white-light source is reaching its detection limit. To overcome the limitation, a defect inspection system using UV confocal microscopy was recently introduced. In this paper, we investigated characteristics of UV confocal microscopy, which is confocal microscopy using UV light source, by analyzing TDI images captured by a defect inspection system with UV confocal microscopy. The results of this study showed that UV confocal microscopy has higher sensitivity and is more efficient for detection of 0.1 μm-level small defects rather than white-light source or conventional microscopy
Keywords
inspection; optical microscopy; 0.1 micron; TDI image; UV confocal microscopy; defect detection; inspection; semiconductor production; Gas detectors; Image resolution; Inspection; Lenses; Light sources; Object detection; Optical imaging; Optical microscopy; Optical sensors; Probes;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-6731-6
Type
conf
DOI
10.1109/ISSM.2001.962990
Filename
962990
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