Title : 
The impact of technology on power for high-speed electrical and optical interconnects
         
        
            Author : 
Cho, Hoyeol ; Kapur, Pawan ; Saraswat, Krishna C.
         
        
            Author_Institution : 
Center for Integrated Syst., Stanford Univ., CA, USA
         
        
        
        
        
        
            Abstract : 
The impact of technology scaling - in the form of transistor performance improvement and a higher demand in bit rate - on power dissipation of short distance electrical and optical interconnects is extensively quantified. We find that: 1) the transistor performance improvement has a similar impact on both types of interconnects, leaving critical length (length above which optical interconnects dissipate lower power) relatively unchanged; 2) the increase in bit rate significantly reduces critical length, favoring optics; 3) at the 32 nm technology node (and beyond) with its commensurate bandwidth requirement, optical interconnect becomes favorable for distances as low as 10 cm corresponding to inter-chip communication; 4) most critical factors in making optical interconnects favorable are reduction in coupling losses and optical detector capacitance.
         
        
            Keywords : 
integrated circuit interconnections; optical communication; optical interconnections; optical receivers; optical transmitters; 10 cm; 32 nm; bandwidth requirement; bit rate; coupling losses; high-speed electrical interconnects; high-speed optical interconnects; inter-chip communication; optical detector capacitance; optical receiver system; optical transmitter system; power dissipation; technology scaling; transistor performance improvement; Bandwidth; Bit rate; Capacitance; High speed optical techniques; Optical coupling; Optical detectors; Optical interconnections; Optical losses; Performance loss; Power dissipation;
         
        
        
        
            Conference_Titel : 
Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International
         
        
            Print_ISBN : 
0-7803-8752-X
         
        
        
            DOI : 
10.1109/IITC.2005.1499970