DocumentCode
1840437
Title
Development of 0.025 mm pitch anisotropic conductive film
Author
Hotta, Yuji ; Maeda, Masako ; Asai, Fumiteru ; Eriguchi, Fuyuki
Author_Institution
Core Technol. Center, Nitto Denko Corp., Osaka, Japan
fYear
1998
fDate
25-28 May 1998
Firstpage
1042
Lastpage
1046
Abstract
Anisotropic conducting adhesive technology for flip chip interconnection, is being actively investigated now. We are now developing new structure of Anisotropic Conductive Film (ACF), which has been designed to be able to connect between a bump-less chip and a high density print circuit board. This paper describes the challenges encountered in the development of this new ACF
Keywords
adhesives; conducting materials; fine-pitch technology; flip-chip devices; printed circuit manufacture; 0.025 mm; adhesive; anisotropic conductive film; flip chip interconnection; print circuit board; Adhesives; Anisotropic conductive films; Conducting materials; Electronic components; Gold; Inorganic materials; Polymer films; Printed circuits; Rough surfaces; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678842
Filename
678842
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