DocumentCode
1840506
Title
Cycle time advantages of mini batch manufacturing and integrated metrology in a 300 mm vertical furnace
Author
Noben, Renzo ; Van Driel, Rien ; Claasen-Vujcic, Tanja
Author_Institution
ASM Int. NV, Bilthoven, Netherlands
fYear
2001
fDate
2001
Firstpage
411
Lastpage
414
Abstract
In order to improve cycle time in the furnace area, two alternatives are evaluated. Mini batch manufacturing and integrated metrology can both save valuable time. Dynamic simulations are used to investigate the influence of both options. The results are a cycle time improvement when going front large batch to mini batch manufacturing. The gain is up to 40% for normal lots and up to 30% for hot lots wafers. The consequence is an increase in the number of required tubes. Cycle time improvement versus costs is analysed. The cost of one hour cycle time gain is determined. Integrated metrology can save approximately 5-10% on the average cycle time
Keywords
batch processing (industrial); furnaces; integrated circuit manufacture; 300 mm; cycle time; dynamic simulation; integrated metrology; mini batch manufacturing; semiconductor wafer fabrication; vertical furnace; Analytical models; Batch production systems; Boats; Costs; Europe; Fabrication; Furnaces; Inductors; Metrology; Silicon carbide;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-6731-6
Type
conf
DOI
10.1109/ISSM.2001.963003
Filename
963003
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