Title :
Development of the inspection system of defects on a CMP (Chemical Mechanical Polishing) pad
Author :
Kim, Kye Weon ; Yang, Yu Sin ; Chun, Chung Sam ; Chun, Sang Mun ; Lee, Dong Chun ; Choi, Sun Yong ; Choi, Sang Bong ; Park, Sung Jin
Author_Institution :
Samsung Electron. Co. Ltd., Gyunggi, South Korea
Abstract :
In CMP(Chemical Mechanical Polishing) process, if there are defects on the polishing pad, scratches are generated on the surface of the semiconductor wafer. We developed the inspection system of defects on the chemical mechanical polishing pad. The system uses a white light source and a CCD camera in order to inspect defects. We use the threshold method in order to find defects from images captured by the CCD camera, and the system can sort defects by size
Keywords :
CCD image sensors; chemical mechanical polishing; inspection; CCD camera; chemical mechanical polishing pad; defect inspection system; image capture; semiconductor wafer; surface scratch; threshold method; white light source; Atherosclerosis; Charge coupled devices; Charge-coupled image sensors; Chemicals; Inspection; Light sources; Planarization; Sensor arrays; Silicon compounds; Slurries;
Conference_Titel :
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6731-6
DOI :
10.1109/ISSM.2001.963004
