DocumentCode
1840635
Title
Validity of mutual inductor model for electromagnetic coupling between vias in integrated-circuit packages and printed circuit boards
Author
Zhao, Jin ; Fang, Jiayuan
Author_Institution
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1998
fDate
25-28 May 1998
Firstpage
1083
Lastpage
1088
Abstract
The procedure of extracting mutual inductor model between vias is demonstrated. Then the validity of the mutual inductor model is studied by comparing the solution from the mutual inductor model with that from the full-wave field simulation. It is found that the valid frequency range of the mutual inductor model is mostly determined by the lowest resonant frequency of the package structure
Keywords
electromagnetic coupling; inductors; integrated circuit packaging; printed circuit design; electromagnetic coupling; full-wave field simulation; integrated-circuit packages; mutual inductor model; package structure; printed circuit boards; resonant frequency; valid frequency range; Coupling circuits; Electromagnetic coupling; Electromagnetic modeling; Electronics packaging; Inductors; Integrated circuit packaging; Mutual coupling; Power supplies; Printed circuits; Resonant frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678849
Filename
678849
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