A CMOS image sensor module applied for a digital still camera utilizing the TOG (TAB On Glass) bonding method

Author

Segawa, Masao ; Ono, Michiko ; Musha, Sei ; Kishimoto, Yasukazu ; Ohashi, Akihiro

Author_Institution

Manuf. Eng. Res. Center, Toshiba Corp., Yokohama, Japan

fYear

1998

fDate

25-28 May 1998

Firstpage

1109

Lastpage

1114

Abstract

The world´s smallest (105×55×20 mm) and lightest (130 g) digital still camera has been developed, in which a 330 kpixel CMOS image sensor chip is used as an image sensor. The authors have developed a new thinner and smaller image sensor module, called TOG (TAB On Glass) module, using the ACP (Anisotropic Conductive Paste) interconnection method. The TOG production process was established by obtaining optimum bonding conditions for both optical glass bonding and CMOS chip bonding to the TAB tape. The bonding conditions, including sufficient bonding margins, were mainly studied. The TOG module obtained good imaging properties. It also has a high reliability such as thermal cycle test (-10 to +110°C/30 min, 2000 cycles) and the high temperature storage test (60°C, 90%RH, 3000 h). The stable production process was confirmed by developing an automatic bonding machine

Keywords

CMOS image sensors; cameras; integrated circuit packaging; integrated circuit reliability; modules; optical glass; tape automated bonding; -10 to 110 C; 105 mm; 130 g; 20 mm; 330 kpixel; 55 mm; ACP interconnection method; CMOS chip bonding; CMOS image sensor module; TAB on glass bonding method; TAB tape; TOG bonding method; TOG production process; anisotropic conductive paste interconnection; automatic bonding machine; digital still camera; high reliability; high temperature storage test; microassembing; optical glass bonding; optimum bonding conditions; stable production process; thermal cycle test; Anisotropic magnetoresistance; Bonding; CMOS image sensors; Digital cameras; Geometrical optics; Glass; Image sensors; Optical interconnections; Production; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678853

Filename

678853