Title :
HP´s PA7100LC: a low-cost superscalar PA-RISC processor
Author :
Knebel, Patrick ; Arnold, Barry ; Bass, Mick ; Kever, Wayne ; Lamb, Joel D. ; Lee, Ruby B. ; Perez, Paul L. ; Undy, Stephen ; Walker, Will
Author_Institution :
Hewlett Packard Co., Ft. Collins, CO, USA
Abstract :
Describes a new low-cost, superscalar PA-RISC processor including two integer arithmetic and logic units, a floating-point coprocessor, and a memory and I/O controller on a single VLSI chip. It implements the full PA-RISC1.1 functionality and adds several new features, including little-endian capability, uncacheable memory pages, and new multimedia instructions. The chip is fabricated in 0.8- mu m, three-level metal CMOS and is designed to run from 0 to 75 MHz. The cache system consists of an off-chip combined instruction/data cache ranging from 8 kByte to 2 MByte and a small on-chip instruction buffer. Memory consists of 4 MByte to 2 GByte of standard DRAMs or SIMMs (single in-line memory modules) connecting directly to the processor chip. The chip achieves performance levels comparable to those of previous generation high-end workstations while lowering overall system cost and power consumption to make possible a new generation of low-cost systems.<>
Keywords :
CMOS integrated circuits; DRAM chips; Hewlett Packard computers; VLSI; buffer storage; microprocessor chips; multimedia systems; reduced instruction set computing; workstations; 0 to 75 MHz; 0.8 micron; 4 MByte to 2 GByte; 8 kByte to 2 MByte; DRAMs; HP PA7100LC; I/O controller; PA-RISC1.1 functionality; SIMMs; VLSI chip; floating-point coprocessor; high-end workstations; integer arithmetic units; little-endian capability; logic units; low-cost superscalar PA-RISC processor; memory controller; multimedia instructions; off-chip combined instruction/data cache; performance levels; power consumption; single in-line memory modules; system cost; three-level metal CMOS; uncacheable memory pages; CMOS logic circuits; Coprocessors; Costs; Energy consumption; Floating-point arithmetic; Joining processes; Power generation; System-on-a-chip; Very large scale integration; Workstations;
Conference_Titel :
Compcon Spring '93, Digest of Papers.
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-8186-3400-6
DOI :
10.1109/CMPCON.1993.289711