The evaluation of high-reliability adhesive film for T-BGA

Author

Otsuka, Masashi ; Yamagata, Osamu ; Imoto, Takashi ; Takano, Terunari ; Takahashi, Kenji ; Nakayoshi, Hideo

Author_Institution

Microelectron. Center, Toshiba Corp., Kawasaki, Japan

fYear

1998

fDate

25-28 May 1998

Firstpage

1167

Lastpage

1172

Abstract

In the volume production of Tape Ball Grid Array (T-BGA), prevention of delamination between the polyamide tape and the adhesive film has been a serious challenge to the semiconductor packaging community. Since the delamination usually causes solder ball short during the solder reflow process, it is necessary to clarify the mechanism of the delamination as well as to improve the characteristics of the adhesive film. With a view to secure the stable productivity and reliability of the package, we investigated the three following physical characteristics of the adhesive in an attempt to acquire the optimal adhesive solution: resistance to reflow delamination; thermal fatigue; and longer storage life

Keywords

adhesion; adhesives; delamination; integrated circuit packaging; integrated circuit reliability; microassembling; polymer films; reflow soldering; thermal stress cracking; T-BGA package; ball grid array; delamination prevention; evaluation methods; fatigue failure; high-reliability adhesive film; peel strength; polyamide tape; polyimide film; reflow delamination resistance; semiconductor packaging; soak condition; solder balls; solder reflow process; storage life; stress simulation; tape BGA package; thermal expansion; thermal fatigue; thermal mismatch; thermosetting adhesive; volume production; Delamination; Fatigue; Polyimides; Production; Productivity; Rubber products; Semiconductor device packaging; Semiconductor films; Thermal expansion; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678864

Filename

678864