Title :
New types of optoelectronic molding compounds
Author_Institution :
Dexter Electron. Mater., Olean, NY, USA
Abstract :
New optoelectronic molding compounds have been developed which provide 40-50% less moisture absorption than previous generation materials when subjected to 24 hours in boiling water. One of these new materials also exhibits a higher Tg than previous generation compounds. These compounds have other unique characteristics. They transmit at wavelengths as low as 250 nm compared to only 300 nm with some commonly used epoxies, and they are manufactured as a liquid which gives them complete uniformity and optical clarity
Keywords :
moisture; moulding; surface mount technology; 24 h; 250 nm; boiling water; moisture absorption; optical clarity; optoelectronic molding compounds; uniformity; Absorption; Character generation; Glass; Moisture; Optical materials; Optical surface waves; Raw materials; Temperature; Testing; Thermal resistance;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678865