Reliability study of an epoxy-bonded laser-to-fiber assembly

Author

Wu, Derick ; Lee, Y.C. ; Masterson, Pat

Author_Institution

Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA

fYear

1998

fDate

25-28 May 1998

Firstpage

1186

Lastpage

1191

Abstract

A procedure-has been established to evaluate the reliability of different designs for an epoxy-bonded laser-to-fiber assembly. The procedure includes: (1) epoxy characterization to select right materials and curing schedules, (2) bonding strength test to define failure criteria at interfaces, and (3) finite element modeling to choose the designs with acceptable stresses at interfaces. An epoxy material has proven to have excellent thermal stability. The bonding shear strength for epoxy-to-steel adhesion was measured to be 20 Mpa. With this criterion, a finite element model has been developed and verified for a reference case using an existing product with known reliability. The model was then used for a parametric study that identified epoxy thickness and Young´s modulus as critical parameters for reliable connections. The procedure can reduce R&D costs to quickly explore different design concepts with minimum experimental evaluation

Keywords

Young´s modulus; adhesion; finite element analysis; laser reliability; optical fibre couplers; shear strength; thermal stability; Young´s modulus; bonding shear strength; bonding strength test; curing schedules; epoxy characterization; epoxy thickness; epoxy-bonded laser-to-fiber assembly; epoxy-to-steel adhesion; failure criteria; finite element modeling; reliability study; thermal stability; Assembly; Bonding; Curing; Finite element methods; Laser modes; Materials testing; Optical design; Optical materials; Thermal stability; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678871

Filename

678871