DocumentCode
1841181
Title
Low power consumption molded gigabit fiberoptic transceiver module
Author
Go, Hisao ; Nishiyama, Naoki ; Tsumura, Eiji ; Fujimura, Yasushi ; Nakanishi, Hiromi ; Tonai, Ichiro ; Nishie, Mitsuaki
Author_Institution
Optoelectron. R&D Labs., Sumitomo Electr. Ind. Ltd., Yokohama, Japan
fYear
1998
fDate
25-28 May 1998
Firstpage
1192
Lastpage
1198
Abstract
The standardization task of gigabit Ethernet by IEEE802.3z working group is attracting a great deal of attention. The demands for the modules compliant with the standardized specification will be increased. We have successfully developed gigabit fiberoptic transceiver modules compliant with 1000BASE-LX, proposed specification in gigabit Ethernet. The main feature of this module is 3.3 V operation which leads to low power consumption, while most of the conventional modules operate at 5.0 V. We used the newly designed package with lower profile 9.4 mm in height. The carefully designed module´s package was formed by transfer mold encapsulation techniques which contribute to the cost reduction. In this paper, the design, assembling process, and characteristics of the developed module are described
Keywords
assembling; encapsulation; local area networks; moulding; optical fibre communication; packaging; transceivers; 1000BASE-LX; 3.3 V; 9.4 mm; assembling process; cost reduction; gigabit Ethernet; gigabit fiberoptic transceiver modules; moulded modules; power consumption; standardized specification; transfer mold encapsulation techniques; Assembly; Costs; Energy consumption; Ethernet networks; High speed optical techniques; Optical fiber devices; Packaging; Power supplies; Transceivers; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678872
Filename
678872
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