• DocumentCode
    1841189
  • Title

    Design of an LTCC integrated tri-band direct conversion receiver front-end module

  • Author

    Lucero, R. ; Pavio, A. ; Penunuri, D. ; Bost, J.

  • Volume
    3
  • fYear
    2002
  • fDate
    2-7 June 2002
  • Firstpage
    1545
  • Abstract
    This paper presents the results of a front-end receiver module integrating GSM/DCS/PCS band select functions and a direct conversion IC on a low temperature cofired ceramic (LTCC) substrate. The front-end-module (FEM) integrated a SP3T GaAs PHEMT switch for band selection, three SAW filters for pre-selection, and a direct conversion IC for down conversion of the RF signal. Integrated passives included a PCS balun, direct conversion IC matching elements and structures to improve the performance of differential SAW filters. The LTCC module contained 24 embedded passives and 15 surface mount components integrated on a 328 mil/spl times/586 mil, 19-layer multi-layer integrated circuit (MLIC). Receiver sensitivity was better than -114 dBm, the system noise figure was less than 9 dB, and the return loss characteristics measured at the antenna input port were better than 10 dB for all three bands. EM simulation was used to achieve first pass design success and the modeling approach yielded excellent agreement between measured and simulated results.
  • Keywords
    HEMT integrated circuits; UHF filters; ball grid arrays; cellular radio; hybrid integrated circuits; integrated circuit packaging; microwave integrated circuits; microwave switches; personal communication networks; radio receivers; surface acoustic wave filters; 10 dB; 328 mil; 586 mil; 9 dB; EM simulation; GSM/DCS/PCS band select functions; GaAs; IC matching elements; LTCC integrated tri-band direct conversion receiver front-end module; LTCC substrate; PCS balun; RF signal down conversion; SAW filters; SP3T GaAs PHEMT switch; ball grid array interposer; band selection; direct conversion IC; first pass design success; integrated passives; modeling approach; multi-layer integrated circuit; receiver sensitivity; return loss characteristics; surface mount components; Antenna measurements; Ceramics; Distributed control; GSM; Gallium arsenide; PHEMTs; Personal communication networks; SAW filters; Switches; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2002 IEEE MTT-S International
  • Conference_Location
    Seattle, WA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-7239-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.2002.1012150
  • Filename
    1012150