Title :
3D integrated LTCC module using /spl mu/BGA technology for compact C-band RF front-end module
Author :
Pinel, S. ; Chakraborty, S. ; Roellig, M. ; Kunze, R. ; Mandal, S. ; Liang, H. ; Lee, C.-H. ; Li, R. ; Lim, K. ; White, G. ; Tentzeris, M. ; Laskar, J.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents a novel 3D integration approach for system-on-package (SOP) based solutions for wireless communication applications. This concept has been applied for the 3D integration of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LTCC substrates using /spl mu/BGA technology. Characterization and modeling of RF vertical board-to-board transition, using /spl mu/BGA process are presented for the first time. Specific investigations for 5.8 GHz WLAN applications such as high performance embedded band-pass filter design, and a via-fed stacked cavity-backed patch antenna development are reported. GaAs MESFET-based Rx and Tx chipset is implemented in GaAs MESFET process and combined with the suggested package structure, demonstrating 3D integration concept suitable for C-band wireless communication applications.
Keywords :
MESFET integrated circuits; ball grid arrays; band-pass filters; ceramic packaging; microstrip antennas; modules; wireless LAN; /spl mu/BGA technology; 3D integrated LTCC module; 5.8 GHz; C-band; GaAs; RF front-end module; embedded band-pass filter; package structure; system-on-package based solutions; vertical board-to-board transition; via-fed stacked cavity-backed patch antenna; wireless LAN; wireless communication applications; Band pass filters; Costs; Gallium arsenide; MESFETs; Packaging; Radio frequency; Stacking; Transmitters; Wireless LAN; Wireless communication;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1012152