DocumentCode :
1841307
Title :
A cost effective ceramic package for LD/PD module in subscriber system
Author :
Yanagisawa, Mitsuo ; Tomie, Satoru ; Tanahashi, Shigeo
Author_Institution :
Kyocera Corp. Shiga Plant, Japan
fYear :
1998
fDate :
25-28 May 1998
Firstpage :
1216
Lastpage :
1218
Abstract :
Proposes a new concept ceramic package for LD/PD module in subscriber system to meet the demand of significant package cost reduction. Subscriber system requires not only cost reduction but also high reliability in a harsh environment. Ceramic packages utilized in trunk lines show good reliability. We propose a new ceramic package which is cost effective. The new ceramic package is a DIP type package which has good operation of assembly on circuit board and good capability for mass production of assembly on circuit board and for mass production of the package. An outer pin pitch of the package has same pitch as 14 pin type or Minidil type structure for ease of circuit board mounting and utilization of industrial standard pin pitch saves the cost of circuit board modification. The new ceramic package has two stage grooves. The first groove holds optical fiber feed with organic adhesive and the fiber core is mounted on the second groove. This two-stage groove structure allows strong fiber attachment to the package. We evaluate reliability by observing change in light power of LD module after assembly of the LD module utilizing silicon V-groove platform and encapsulation by ceramic lid with epoxy sealant which has low Young´s modulus. The change in light power from LD module after high temperature and high humidity test of 85C/85%, 2000 hour was less than +/-1 dB. This result indicates that the new ceramic package has capability for use reliability and cost effective
Keywords :
adhesives; ceramic packaging; optical fibre couplers; photodiodes; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; 2000 h; 85 degC; DIP type package; LD/PD module; Minidil type structure; V-groove platform; Young´s modulus; ceramic lid; ceramic package; epoxy sealant; fiber attachment; harsh environment; humidity test; industrial standard pin pitch; mass production; organic adhesive; outer pin pitch; package cost reduction; reliability; subscriber system; Assembly; Ceramics; Costs; Electronics packaging; Encapsulation; Feeds; Mass production; Optical fibers; Printed circuits; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
ISSN :
0569-5503
Print_ISBN :
0-7803-4526-6
Type :
conf
DOI :
10.1109/ECTC.1998.678881
Filename :
678881
Link To Document :
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