Property trend analysis and simulations of adhesive formulation effects in the microelectronics packaging industry using molecular modeling

Prediction of wetting properties such as resin bleed, underfill flow and adhesion will become increasingly important to the microelectronics packaging industry as higher levels of reliability are sought for both manufacturability and end-performance. Because the relationship between the adhesive formulation and the substrate is often difficult to predict and is not easy to generalize, methods of characterizing and simulating the effects of the formulation are warranted. Johnson Matthey has been addressing the formulation-side of these issues by using molecular modeling to simulate the physical effects of the formulation on properties. This paper specifically concentrates on the results of using molecular modeling to predict formulation effects on the performance of adhesive materials