Probabilistic prediction of wireability and routing requirements for high density interconnect substrates

Estimation of wiring and routability requirements for printed wiring boards (PWB), multi-chip modules (MCM), integrated circuit (IC´s) and other high density substrates, such as micro-via, is crucial for the development of new technologies, design, and CAD tools. This paper describes a new approach to wireability estimation that goes beyond the outmoded Rent´s rule by utilizing data flow and placement information available at the early stages of the design process. Excellent overall agreement between our predictions and published wiring data has been obtained for two actual MCM implementations. The relationship between placement and wireability will be presented through an optimization study considering wiring parameters and their distributions as metrics. This study will also serve the application of this work to other problems