DocumentCode
1841754
Title
ESD measurement methods for carrier tape packing material for ESDS semiconductor device
Author
Lee, Shih Ming
Author_Institution
STMicroelectron. Pte Ltd., Singapore, Singapore
fYear
2012
fDate
9-14 Sept. 2012
Firstpage
1
Lastpage
10
Abstract
Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is proposed.
Keywords
electrostatic discharge; semiconductor devices; ESD measurement methods; ESDS semiconductor device; carrier tape packing material; carrier tape top surface resistance; tape body; Electrical resistance measurement; Electrostatic discharges; Immune system; Pins; Probes; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2012 34th
Conference_Location
Tucson, AZ
ISSN
0739-5159
Print_ISBN
978-1-4673-1467-1
Type
conf
Filename
6333356
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