Title :
ESD measurement methods for carrier tape packing material for ESDS semiconductor device
Author_Institution :
STMicroelectron. Pte Ltd., Singapore, Singapore
Abstract :
Today, it is commonly assumed that carrier tape top surface resistance is equivalent to resistance in carrier tape pockets and also that there is always continuity between pockets and tape body. This article explains why these assumptions are incorrect and an alternative method of measurement is proposed.
Keywords :
electrostatic discharge; semiconductor devices; ESD measurement methods; ESDS semiconductor device; carrier tape packing material; carrier tape top surface resistance; tape body; Electrical resistance measurement; Electrostatic discharges; Immune system; Pins; Probes; Surface resistance;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2012 34th
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-4673-1467-1
