Title :
TMA, DMA, DSC, and TGA of lead free solders
Author :
Lau, John H. ; Chang, Chris
Author_Institution :
Express Packaging Syst. Inc., Palo Alto, CA, USA
Abstract :
Most of the electronics packaging materials, especially solders are temperature dependent. Their temperature-dependent material properties can be obtained by TMA (thermal mechanical analysis), DMA (dynamic mechanical analysis), DSC (differential scanning calorimeter), and TGA (thermogravimetric analysis). In this study, the thermal coefficient of expansion (TCE), storage modulus, moisture uptake, and melting point of two lead free solders, 96.5wt%Sn-3.5wt%Ag and 42wt%Sn-58wt%Bi provided from two different vendors, are measured by, respectively, TMA, DMA, TGA, and DSC. For comparison purpose, the 63wt%Sn-37wt%Pb solder is also considered
Keywords :
bismuth alloys; elastic moduli; materials testing; melting point; moisture; packaging; silver alloys; soldering; thermal analysis; thermal expansion; tin alloys; SnAg; SnBi; TCE; differential scanning calorimeter; dynamic mechanical analysi; electronics packaging material; lead free solders; melting point; moisture uptake; storage modulus; temperature-dependent material properties; thermal coefficient of expansion; thermal mechanical analysis; thermogravimetric analysis; Assembly; Chip scale packaging; Electronic packaging thermal management; Electronics packaging; Energy measurement; Environmentally friendly manufacturing techniques; Lead; Mechanical factors; Moisture; Temperature;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678918
