Moisture diffusion and vapour pressure modeling of IC packaging

Author

Wong, Ee Hua ; Teo, Yong Chua ; Lim, Thiam Beng

Author_Institution

Inst. of Microelectron., Singapore

fYear

1998

fDate

25-28 May 1998

Firstpage

1372

Lastpage

1378

Abstract

A new physical quantity-wetness fraction-has been introduced to overcome the concentration discontinuity in the application of Fick´s diffusion equation to multi-material systems such as in plastic IC packaging. This enables the use of commercial thermal diffusion software to model the transient moisture diffusion phenomenon in IC packaging. More significantly, the wetness fraction provides a simple means of computing the vapour pressure in a delaminated region within an IC package when it is heated up to 230°C during reflow solder. The approach was bench marked against published works and found to corroborate remarkbly well despite its simplicity

Keywords

ball grid arrays; diffusion; electronic engineering computing; finite element analysis; integrated circuit packaging; moisture; plastic packaging; reflow soldering; surface mount technology; vapour pressure; 230 C; Fick´s diffusion equation; IC packaging; concentration discontinuity; delaminated region; finite element implementation; moisture diffusion; multi-material systems; plastic BGA; plastic packaging; popcorn cracking; reflow solder; surface mounting; thermal diffusion software; vapour pressure modeling; wetness fraction; Electronic packaging thermal management; Equations; Integrated circuit modeling; Integrated circuit packaging; Microelectronics; Moisture; Plastic packaging; Semiconductor device modeling; Temperature; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678922

Filename

678922