Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects

Author

Beker, Benjamin ; Yee, Ian ; Miracky, Robert

Author_Institution

Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA

fYear

1998

fDate

25-28 May 1998

Firstpage

1379

Lastpage

1383

Abstract

This paper describes the modeling approach and numerical results of MCM transmission lines formed by interwoven metallization patterns. The impedance of the signal traces is calculated based on quasistatic field approximations. The differences between conventional microstrip and interwoven transmission lines are pointed out and ample data are provided for the “weaved” line as a function of several geometrical parameters

Keywords

application specific integrated circuits; integrated circuit interconnections; multichip modules; wiring; MCM transmission lines; electromagnetic analysis; geometrical parameters; high-density multi-chip module substrates; interwoven metallization patterns; interwoven transmission lines; quasistatic field approximations; semi-custom interconnects; signal trace impedance; Capacitance; Electromagnetic analysis; Impedance; Inductance; Integrated circuit interconnections; Metallization; Microstrip; Power transmission lines; Signal design; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678923

Filename

678923