Title :
A highly integrated MMIC chipset for 60 GHz broadband wireless applications
Author :
Vaudescal, O. ; Lefebvre, B. ; Lehoue, V. ; Quentin, P.
Author_Institution :
United Monolithic Semicond., Orsay, France
Abstract :
A full and flexible MMIC (monolithic microwave integrated circuit) chipset has been developed for 60 GHz broadband wireless applications. It is based on several circuits operating in the 55-65 GHz frequency range. The MMICs have been fabricated on commercially available 0.25 and 0.15 /spl mu/m GaAs pHEMT processes. The chipset is focused on a MMIC multifunction chip (MFC) including a sub-harmonic mixer and an LO buffer allowing carrier 2/spl times/LO suppression and image rejection. Several frequency multipliers by 2, 3 and 4 have been produced for the LO supply chain and use balancing topologies leading to fundamental or even-harmonics suppression improvement. Finally, a complete family of low noise/medium power amplifiers is described. All the circuits have been designed in order to ease integration, to reduce size and to achieve the cost requirements for such systems.
Keywords :
HEMT integrated circuits; III-V semiconductors; MMIC frequency convertors; MMIC mixers; MMIC power amplifiers; field effect MIMIC; frequency multipliers; gallium arsenide; millimetre wave frequency convertors; millimetre wave mixers; millimetre wave power amplifiers; 0.15 micron; 0.25 micron; 55 to 65 GHz; 60 GHz broadband wireless applications; GaAs; GaAs pHEMT processes; LO buffer; LO supply chain; MMIC chipset; MMIC multifunction chip; balancing topologies; carrier 2/spl times/LO suppression; even-harmonics suppression; frequency multipliers; image rejection; low noise/medium power amplifiers; sub-harmonic mixer; Application specific integrated circuits; Circuit noise; Circuit topology; Frequency; Gallium arsenide; MMICs; Microwave integrated circuits; Monolithic integrated circuits; PHEMTs; Supply chains;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1012194