Title :
Thermo-mechanical creep of two solder alloys
Author :
Ren, Wei ; Qian, Zhengfang ; Liu, Sheng
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
Abstract :
Thermo-mechanical creep behaviors of a new lead free solder alloy 80Sn10In9.5Bi0.5Ag and eutectic solder alloy 63Sn37Pb are investigated in this paper. By using specially designed thin strip specimens and a computer controlled 6-axis mini fatigue tester, a series of reliable and consistent creep data are obtained. The 80Sn10In9.5Bi0.5Ag solder alloy shows very attractive creep characteristics and may have potential applications in electronics packaging technology. On the other hand, a new unified viscoplastic constitutive model proposed by Qian and Liu (1997b) is introduced to predict the creep properties of eutectic solder alloy. An excellent agreement between experimental data and model predictions is achieved. It is also observed that the creep rupture time will be significantly overpredicted if only power law regime is considered
Keywords :
bismuth alloys; creep; fatigue testing; indium alloys; integrated circuit packaging; lead alloys; silver alloys; soldering; tin alloys; viscoplasticity; IC packaging; SnInBiAg; SnPb; creep characteristics; electronics packaging technology; mini fatigue tester; power law regime; rupture time; solder alloys; thermo-mechanical creep; thin strip specimens; viscoplastic constitutive model; Application software; Creep; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Predictive models; Strips; Testing; Thermomechanical processes;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678932
