• DocumentCode
    1842444
  • Title

    Ultra-thin electromagnetic bandgap absorbers synthesized via genetic algorithms

  • Author

    Kern, D.J. ; Werner, D.H.

  • Author_Institution
    Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
  • Volume
    2
  • fYear
    2003
  • fDate
    22-27 June 2003
  • Firstpage
    1119
  • Abstract
    A design methodology is presented for utilizing electromagnetic bandgap meta-materials, also known as artificial magnetic conductors, to realize ultra-thin absorbers. One approach that has recently been proposed is to place a resistive sheet in close proximity to a frequency selective surface acting as an artificial magnetic conductor. However, we demonstrate that incorporating the loss directly into the frequency selective surface can eliminate the additional resistive sheet, thereby further reducing the overall thickness of the absorber. A genetic algorithm is used to optimize the geometrical structure and corresponding resistance of the lossy frequency selective surface in order to achieve the thinnest possible design. Two examples of genetically engineered electromagnetic bandgap meta-material absorbers are presented and discussed.
  • Keywords
    electromagnetic wave absorption; electromagnetic wave scattering; frequency selective surfaces; genetic algorithms; radar cross-sections; absorber thickness; artificial magnetic conductors; design methodology; electromagnetic bandgap meta-materials; frequency selective surface; genetic algorithms; genetically engineered electromagnetic bandgap meta-material absorbers; geometrical structure; lossy frequency selective surface resistance; resistive sheet; ultra-thin electromagnetic bandgap absorbers; Conductors; Design methodology; Design optimization; Frequency selective surfaces; Genetic algorithms; Optimization methods; Photonic band gap; Radar cross section; Robustness; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Conference_Location
    Columbus, OH, USA
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1219432
  • Filename
    1219432