Title :
Compensating differences between measurement and calibration wafer in probe-tip calibrations
Author :
Carchon, G. ; De Raedt, W. ; Beyne, E.
Author_Institution :
IMEC, Heverlee, Belgium
Abstract :
Differences in probe-tip-to-line geometry and substrate permittivity between measurement and calibration wafer deteriorate measurement accuracy. In this paper, we compare the accuracy of several models for the probe-to-line transition based on measurements as well as 3-D simulations of various GaAs CPW lines. This shows that 3-D simulations may be used to determine the parasitics at the probe tip as an alternative to measurement based methods. In general, models using 4 error-parameters are preferred to the Y/sub p/- or TL-based model as they provide a higher accuracy while the same amount of measurements is required to implement them.
Keywords :
III-V semiconductors; calibration; coplanar waveguides; gallium arsenide; microwave measurement; 3D simulation; GaAs; GaAs CPW line; TL model; Y/sub p/ model; calibration wafer; compensation; error parameters; measurement wafer; parasitics; probe-tip calibration; probe-to-line transition; substrate permittivity; Calibration; Coplanar waveguides; Gallium arsenide; Geometry; Impedance measurement; Inductance; Length measurement; Permittivity measurement; Probes; Strips;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1012220