DocumentCode
184298
Title
Application of locally weighted partial least squares to design of semiconductor virtual metrology
Author
Hirai, T. ; Hazama, K. ; Kano, M.
Author_Institution
Sony Energy Devices Corp., Koriyama, Japan
fYear
2014
fDate
8-10 Oct. 2014
Firstpage
1771
Lastpage
1776
Abstract
In the semiconductor industry, virtual metrology (VM) has been widely investigated and used to predict important characteristics of products. However, VM is not always successful because its prediction performance deteriorates due to changes in process characteristics. In particular, maintenance of equipment strongly affects the process characteristics and the prediction performance. In the present work, VM was developed by using locally weighted partial least squares (LW-PLS), which is a type of Just-In-Time modeling technique. The developed VM was applied to a dry etching process and a chemical mechanical polishing (CMP) process. The industrial application results have shown that the developed VM based on LW-PLS is superior to the conventional VM based on sequential update model (SUM), locally weighted regression (LWR), and PLS. Furthermore, it has been confirmed that the LW-PLS-based VM can keep its high prediction performance even after the maintenance, i.e. replacement of parts.
Keywords
etching; just-in-time; least squares approximations; maintenance engineering; measurement; polishing; semiconductor industry; CMP process; LW-PLS; VM; chemical mechanical polishing; dry etching process; equipment maintenance; just-in-time modelling; locally weighted partial least squares; semiconductor industry; semiconductor virtual metrology design; Data models; Dry etching; Input variables; Maintenance engineering; Semiconductor device modeling; Vectors;
fLanguage
English
Publisher
ieee
Conference_Titel
Control Applications (CCA), 2014 IEEE Conference on
Conference_Location
Juan Les Antibes
Type
conf
DOI
10.1109/CCA.2014.6981569
Filename
6981569
Link To Document