• DocumentCode
    184298
  • Title

    Application of locally weighted partial least squares to design of semiconductor virtual metrology

  • Author

    Hirai, T. ; Hazama, K. ; Kano, M.

  • Author_Institution
    Sony Energy Devices Corp., Koriyama, Japan
  • fYear
    2014
  • fDate
    8-10 Oct. 2014
  • Firstpage
    1771
  • Lastpage
    1776
  • Abstract
    In the semiconductor industry, virtual metrology (VM) has been widely investigated and used to predict important characteristics of products. However, VM is not always successful because its prediction performance deteriorates due to changes in process characteristics. In particular, maintenance of equipment strongly affects the process characteristics and the prediction performance. In the present work, VM was developed by using locally weighted partial least squares (LW-PLS), which is a type of Just-In-Time modeling technique. The developed VM was applied to a dry etching process and a chemical mechanical polishing (CMP) process. The industrial application results have shown that the developed VM based on LW-PLS is superior to the conventional VM based on sequential update model (SUM), locally weighted regression (LWR), and PLS. Furthermore, it has been confirmed that the LW-PLS-based VM can keep its high prediction performance even after the maintenance, i.e. replacement of parts.
  • Keywords
    etching; just-in-time; least squares approximations; maintenance engineering; measurement; polishing; semiconductor industry; CMP process; LW-PLS; VM; chemical mechanical polishing; dry etching process; equipment maintenance; just-in-time modelling; locally weighted partial least squares; semiconductor industry; semiconductor virtual metrology design; Data models; Dry etching; Input variables; Maintenance engineering; Semiconductor device modeling; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control Applications (CCA), 2014 IEEE Conference on
  • Conference_Location
    Juan Les Antibes
  • Type

    conf

  • DOI
    10.1109/CCA.2014.6981569
  • Filename
    6981569