• DocumentCode
    1843033
  • Title

    A micromachined finite coplanar line-to-silicon micromachined waveguide transition for millimeter and submillimeter wave applications

  • Author

    Yongshik Lee ; Becker, J.P. ; East, J.R. ; Katehi, L.P.B.

  • Author_Institution
    Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA
  • Volume
    3
  • fYear
    2002
  • fDate
    2-7 June 2002
  • Firstpage
    1871
  • Abstract
    A finite ground coplanar (FGC) line-to-waveguide transition utilizing a novel, free-standing printed E-plane probe has been demonstrated in W-band (75-110 GHz). One way to improve the performance of such a transition and to extend its utility well into the submillimeter range is to thin the supporting substrate beneath the probe. This paper presents the W-band performance of a fully micromachined finite ground coplanar line-to-silicon diamond waveguide transition with the substrate beneath the probe entirely removed, thus forming a free-standing metal structure.
  • Keywords
    coplanar waveguides; micromachining; rectangular waveguides; waveguide transitions; 75 to 110 GHz; Si; W-band performance; finite ground coplanar line-to-waveguide transition; free-standing metal structure; free-standing printed E-plane probe; micromachined finite coplanar line-to-silicon micromachined waveguide transition; millimeter wave applications; silicon micromachined diamond waveguide; submillimeter range; supporting substrate thinning; Coplanar waveguides; Electromagnetic waveguides; Frequency; Insertion loss; Permittivity; Probes; Rectangular waveguides; Silicon; Transmission line theory; Waveguide transitions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2002 IEEE MTT-S International
  • Conference_Location
    Seattle, WA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-7239-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.2002.1012228
  • Filename
    1012228