Application of Time Domain Measurement and Characterization to the Modeling of Leadframes of Plastic Packages for RFIC Devices

Author

Riad, Sedki M. ; Salama, Iman ; Su, Wansheng ; Rachlin, Michael ; Baker, Walter ; Perdue, James

Author_Institution

Time Domain Laboratoty, The Bradley Department of Electrical Engineering, Virginia Tech, Blacksburg, Virginia 24061-0111, Phone (540) 231-4463 - Fax (540) 231-3362 - Email: sriad@vt.edu

Volume

30

fYear

1996

fDate

Dec. 1996

Firstpage

65

Lastpage

69

Abstract

This paper presents a time domain measurements and simulation technique for Characterization and modeling of wideband and microwave electronic structures. The technique is successfully applied to the Leadframes of plastic packages for RFIC devices. The modeling process leads to the development of spice-models for the leadframe and wirebonds used in the package and hence enable the designer to improve the circuit performance by considering the packaging effects. Electrical modeling was performed on a 16 lead SOIC plastic package using time domain approach. The developed models have been successfully used by ITT GTC in developing a new generation of power amplifier RFIC´s.

Keywords

Circuit optimization; Electronics packaging; Microwave devices; Microwave measurements; Microwave theory and techniques; Plastic packaging; Power generation; Radiofrequency integrated circuits; Time measurement; Wideband;

fLanguage

English

Publisher

ieee

Conference_Titel

ARFTG Conference Digest-Fall, 48th

Conference_Location

Clearwater, FL, USA

Print_ISBN

0-7803-5686-1

Type

conf

DOI

10.1109/ARFTG.1996.327190

Filename

4119872