DocumentCode
1843142
Title
Electromagnetic modeling of interconnects for mixed-signal integrated circuits from DC to multi-GHz frequencies
Author
Rong, A. ; Cangellaris, A.C.
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Volume
3
fYear
2002
fDate
2-7 June 2002
Firstpage
1893
Abstract
This paper presents a numerically stable methodology for the electromagnetic analysis of three-dimensional interconnect structures from very low (almost dc) to multi-GHz frequencies. The proposed methodology is based on a generalized version of the partial element equivalent circuit interpretation of the electric field integral equation that utilizes triangular cells for the discretization of conductor surfaces and thus is capable of handling structures of arbitrary shapes. The numerical stability of the approximate problem at very low frequencies is achieved through capturing an appropriate tree of the network graph, yielding an enhanced circuit mesh analysis. Numerical experiments are used to demonstrate the numerical stability of the numerical methodology even for frequencies at which the structure under study is a minute fraction of the wavelength.
Keywords
electric field integral equations; electromagnetic interference; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; mixed analogue-digital integrated circuits; numerical stability; trees (mathematics); 1 kHz to 10 GHz; arbitrary shape structures; conductor surface discretization; electric field integral equation; electromagnetic analysis; electromagnetic interference prediction; electromagnetic modeling; enhanced circuit mesh analysis; mixed-signal IC interconnects; multi-GHz frequencies; network graph tree; numerical stability; numerically stable methodology; partial element equivalent circuit interpretation; three-dimensional interconnect structures; triangular cells; Conductors; Electromagnetic analysis; Electromagnetic modeling; Equivalent circuits; Frequency; Integral equations; Integrated circuit interconnections; Numerical stability; Shape; Tree graphs;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location
Seattle, WA, USA
ISSN
0149-645X
Print_ISBN
0-7803-7239-5
Type
conf
DOI
10.1109/MWSYM.2002.1012233
Filename
1012233
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