Title :
Integration of micro heat sink in silicon technology
Author :
Perret, C. ; Schaeffer, Ch ; Boussey, J.
Author_Institution :
Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France
Abstract :
The use of microchannels in silicon substrates as a forced liquid cooling device for power integrated circuits is investigated. The new concept presented in this work consists of placing water cooled heat sink structure directly inside the silicon substrate in order to be as close as possible to the heat generation source (circuit) and to reduce the number of heterojunctions involved in the cooling device, so to reduce the thermal stress. Thanks to commercially available software, Flux3D and Pascosma, some simplifying hypotheses were proposed and thermal dissipation characteristics are optimised for several microchannel geometries as a function of some constraints. Finally, fin technological realisation procedure is described
Keywords :
cooling; electronic engineering computing; elemental semiconductors; heat sinks; power integrated circuits; silicon; thermal stresses; Flux3D; Pascosma; Si; fin technological realisation procedure; forced liquid cooling device; heat generation source; heterojunctions; micro heat sink; microchannel geometries; microchannels; power integrated circuits; thermal dissipation characteristics; thermal stress; water cooled heat sink structure; Heat sinks; Heterojunctions; Integrated circuit technology; Liquid cooling; Microchannel; Power integrated circuits; Silicon; Thermal stresses; Water heating; Water resources;
Conference_Titel :
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-5033-2
DOI :
10.1109/IWIPP.1998.722305
