DocumentCode
1843594
Title
Compact Ka-band reconfigurable switch matrix with power failure redundancy
Author
Kaleem, S. ; Humbla, S. ; Rentsch, S. ; Trabert, J. ; Stöpel, D. ; Müller, J. ; Hein, M.A.
Author_Institution
Inst. for Micro- & Nanotechnol., Ilmenau Univ. of Technol., Ilmenau, Germany
fYear
2012
fDate
12-14 March 2012
Firstpage
1
Lastpage
4
Abstract
A compact 4×4 reconfigurable switch matrix with augmented functionality for Ka-band (17 - 22 GHz) space applications, based on Low-Temperature Co-fired Ceramic technology, is presented. In contrast to a preceding version, the matching networks were moved from the top layer to buried layers, and two external peripherals (digitally controlled bipolar current sources to bias PIN switches) were hybrid-integrated into the module. The module surface area measures only 25 mm × 25 mm, compared to former dimensions of 34 mm × 32 mm, corresponding to 40% size reduction. As an additional functionality, the vacant space in buried layers is exploited to furnish transparent paths bypassing the switch matrix module in case of power failure. The paper presents a promising approach for the design and implementation of transparent paths.
Keywords
buried layers; ceramic packaging; microwave integrated circuits; microwave switches; multichip modules; p-i-n diodes; redundancy; Ka-band space applications; LTCC; PIN switch; buried layers; compact Ka-band reconfigurable switch matrix; digitally controlled bipolar current sources; frequency 17 GHz to 22 GHz; hybrid integrated peripherals; low-temperature co-fired ceramic technology; matching networks; multichip module; power failure redundancy; transparent paths; Coplanar waveguides; Couplers; Impedance; Microwave circuits; Microwave imaging; Switches; Transmission line matrix methods; Ka-band; Low-temperature co-fired ceramics (LTCC); hybrid integration; microwave switch matrix; multichip module; power failure redundancy; shielded coplanar waveguides; space applications;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference (GeMiC), 2012 The 7th German
Conference_Location
Ilmenau
Print_ISBN
978-1-4577-2096-3
Electronic_ISBN
978-3-9812668-4-9
Type
conf
Filename
6185221
Link To Document