Title :
Compact Ka-band reconfigurable switch matrix with power failure redundancy
Author :
Kaleem, S. ; Humbla, S. ; Rentsch, S. ; Trabert, J. ; Stöpel, D. ; Müller, J. ; Hein, M.A.
Author_Institution :
Inst. for Micro- & Nanotechnol., Ilmenau Univ. of Technol., Ilmenau, Germany
Abstract :
A compact 4×4 reconfigurable switch matrix with augmented functionality for Ka-band (17 - 22 GHz) space applications, based on Low-Temperature Co-fired Ceramic technology, is presented. In contrast to a preceding version, the matching networks were moved from the top layer to buried layers, and two external peripherals (digitally controlled bipolar current sources to bias PIN switches) were hybrid-integrated into the module. The module surface area measures only 25 mm × 25 mm, compared to former dimensions of 34 mm × 32 mm, corresponding to 40% size reduction. As an additional functionality, the vacant space in buried layers is exploited to furnish transparent paths bypassing the switch matrix module in case of power failure. The paper presents a promising approach for the design and implementation of transparent paths.
Keywords :
buried layers; ceramic packaging; microwave integrated circuits; microwave switches; multichip modules; p-i-n diodes; redundancy; Ka-band space applications; LTCC; PIN switch; buried layers; compact Ka-band reconfigurable switch matrix; digitally controlled bipolar current sources; frequency 17 GHz to 22 GHz; hybrid integrated peripherals; low-temperature co-fired ceramic technology; matching networks; multichip module; power failure redundancy; transparent paths; Coplanar waveguides; Couplers; Impedance; Microwave circuits; Microwave imaging; Switches; Transmission line matrix methods; Ka-band; Low-temperature co-fired ceramics (LTCC); hybrid integration; microwave switch matrix; multichip module; power failure redundancy; shielded coplanar waveguides; space applications;
Conference_Titel :
Microwave Conference (GeMiC), 2012 The 7th German
Conference_Location :
Ilmenau
Print_ISBN :
978-1-4577-2096-3
Electronic_ISBN :
978-3-9812668-4-9