Title :
Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)
Abstract :
The following topics were dealt: Process integration; reliability; interconnection systems; dielectrics; process control; interconnection systems I; CMP/planarisation; low-K; SOC; metallisation; dry process; metallisation; process integration; process integration II; reliability I; interconnection systems II; dielectrics; reliability II.
Keywords :
CMOS digital integrated circuits; chemical mechanical polishing; dielectric materials; dielectric thin films; dipole antennas; integrated circuit interconnections; loop antennas; metallisation; permittivity; prediction theory; radiocommunication; radiowave propagation; semiconductor device reliability; system-on-chip; CMP; IEEE 2003 international interconnect technology conference; SOC; dielectrics; dry process; interconnection systems; metallisation; planarisation; process control; process integration; reliability; CMOS digital integrated circuits; Dielectric films; Dielectric materials; Dipole antennas; Integrated circuit interconnections; Loop antennas; Metallization; Permittivity; Prediction methods; Radio communication; Radio propagation; Semiconductor device reliability;
Conference_Titel :
Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International
Conference_Location :
Burlingame, CA, USA
Print_ISBN :
0-7803-7797-4
DOI :
10.1109/IITC.2003.1219693
