Title :
Accurate Package Modeling Based on S-Parameter Measurements
Author :
Lin, Fujiang ; Iyer, Mahadevan Krishna ; Ma, Huainan ; Tan, Khen Sang ; Kasashima, Masaaki ; Shibata, Junichi ; Nakamura, Hiroshi
Author_Institution :
Institute of Microelectronics, 11 Science Park Road, Singapore 117685, Singapore
Abstract :
This paper presents experimental techniques for accurate package modeling including full L and C matrix characterisation based on VNA technique using RF probe station. Both package lead and bond wire parasitics are considered and determined separately. Advanced equivalent circuit models are developed for RFIC design which has been proven for first-pass success in packaged IC testing.
Keywords :
Bonding; Circuit testing; Equivalent circuits; Integrated circuit modeling; Packaging; Probes; Radio frequency; Radiofrequency integrated circuits; Scattering parameters; Wire;
Conference_Titel :
ARFTG Conference Digest-Spring, 49th
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1997.327228
