Title :
Compact physical IR-drop models for GSI power distribution networks
Author :
Shakeri, Kaveh ; Meindl, James D.
Author_Institution :
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The supply voltage decrease and power density increase of future GSI chips demands accurate models for the IR-drop voltage. Compact physical IR-drop models are derived for two types of packages. These models help designers estimate the required amount of interconnects and package pins which need to be dedicated for power distribution. Comparison with SPICE simulations show less than 1% and 5% error for the wire-bond package and the area-array package, respectively.
Keywords :
SPICE; ULSI; distribution networks; integrated circuit interconnections; lead bonding; GSI power distribution networks; IR-drop models; SPICE; area-array package; gigascale integration; interconnects; package pins; simulation program with integrated circuit emphasis; wire-bond package; Boundary conditions; Current density; Microelectronics; Packaging; Partial differential equations; Pins; Power distribution; Power systems; SPICE; Voltage;
Conference_Titel :
Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International
Print_ISBN :
0-7803-7797-4
DOI :
10.1109/IITC.2003.1219711
