DocumentCode
1844979
Title
A low-area interconnect architecture for chip multiprocessors
Author
Yu, Zhiyi ; Baas, Bevan M.
Author_Institution
ECE Dept., Univ. of California, Davis, CA
fYear
2008
fDate
18-21 May 2008
Firstpage
2857
Lastpage
2860
Abstract
A new inter-processor communication architecture for chip multiprocessors is proposed which has a low area cost and flexible routing capability. To achieve a low area cost, the proposed statically-configurable asymmetric architecture assigns large buffer resources only to the nearest neighbor interconnect and much smaller buffer resources for long distance interconnect. To maintain flexible routing capability, each neighboring processor pair has two connecting links. Compared to a traditional dynamically-configurable interconnect architecture with symmetric buffer allocation and single-links between neighboring processor pairs, this implementation has approximately 2 times smaller communication circuitry area with a similar routing capability. Area and speed estimates are obtained with the physical design of seven chips in 0.18 mum CMOS.
Keywords
CMOS digital integrated circuits; integrated circuit interconnections; microprocessor chips; CMOS; buffer resources; chip multiprocessors; inter-processor communication architecture; low-area interconnect architecture; size 0.18 mum; statically-configurable asymmetric architecture; Communication system control; Computer architecture; Costs; Delay; Flexible printed circuits; Integrated circuit interconnections; Logic; Nearest neighbor searches; Network-on-a-chip; Routing;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2008. ISCAS 2008. IEEE International Symposium on
Conference_Location
Seattle, WA
Print_ISBN
978-1-4244-1683-7
Electronic_ISBN
978-1-4244-1684-4
Type
conf
DOI
10.1109/ISCAS.2008.4542053
Filename
4542053
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