High temperature, high reliability integrated hybrid packaging for radiation hardened spacecraft micromachined tunneling accelerometer

This paper summarizes and reports a radiation hardened spacecraft high temperature, high reliability sensor/circuit integrated packaging technology, Tunneling accelerometer integrated circuitry is the first flight-ready demonstration of electronics hybrid packaging as part of electron tunneling sensor. It is a radiation hardened spacecraft MCM IC technology/packaging to operate at elevated temperatures in a 100 krad (Si) environment. The circuit with the sensor is the first microelectromechanical system (MEMS) based on electron tunneling principal in a flight qualified integrated hybrid packaging form. Circuit guarantees automatic tunneling by adjusting tunneling gap (~10 angstroms) with minimum power consumption